Wafer Fab Equipment Parts

Develop the layout of semiconductor component manufacturing technology. It has vacuum process component manufacturing technology. In addition to basic material selection and precision machining, it also has special electrochemical surface treatment, precision sandblasting, plasma spraying, vacuum welding, and precision cleaning. , Functional testing technology, etc. All adopt special semiconductor specifications to pass the wafer yield requirements of high-standard environments. Each special process has undergone long-term improvement and normal monitoring to ensure that all components produced can meet the needs of cutting-edge customers.
At present, the surface treatment processes of aluminum materials such as anodizing, wire drawing, sandblasting, etc. have been very mature, and aluminum materials are also very much used in mobile phones.

1. Material: aluminum
2. Color: according to your need
3. Can be produced according to customer drawings and samples LOGO
4. High quality and prompt delivery time
5. Origin: Taiwan