Potting Compound
Item No.: | JP-131 |
Supplier Details
Country: Taiwan
City: Taichung City 428017
Address: No. 12-1, Qiancun E. Rd., Daya Dist.
TEL: +886-4-25685848
Fax: +886-4-25685857
Online Showroom:
103 Products
Ultra High Thermal Conductivity >6.0W/mK Potting Compound for Servers
Features
Basic Properties
Features
- After curing, it has high strength and rigidity; and thermal conductivity exceeds 6.0 W/mK. (can reach 7.93 W/mK)
- Low viscosity; long working time; easy to defoam.
- Complies with UL94 V-0 and RoHS requirements.
Basic Properties
- Mixture Viscosity @25°C : 700 ~ 1,300 cps
- Density @20°C : 1.9 ~ 2.0 g/cm³
- Curing Conditions : 80°C for 4 hours or 100°C for 3 hours
- Hardness (DIN 53505) : Shore D70 ~ 75
- Glass Transition Temperature (DSC) : 80 ~ 90°C
- Thermal Conductivity (ISO 22007-2.2) : >6 W/mK
- Coefficient of Thermal Expansion : 115 ppm/°C
- Dielectric Strength : 12 kV/mm
- Volume Resistivity @10 - 25°C : >1.0 x 10¹³ ohm-cm
- Shelf Life @10 - 25°C : 6 months (unopened)