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Potting Compound - JP-131

Potting Compound

Item No.: JP-131
Supplier Details
Country: Taiwan
City: Taichung City 428017
Address: No. 12-1, Qiancun E. Rd., Daya Dist.
TEL: +886-4-25685848
Fax: +886-4-25685857
Online Showroom: 103 Products
Ultra High Thermal Conductivity >6.0W/mK Potting Compound for Servers

Features
  • After curing, it has high strength and rigidity; and thermal conductivity exceeds 6.0 W/mK. (can reach 7.93 W/mK)
  • Low viscosity; long working time; easy to defoam.
  • Complies with UL94 V-0 and RoHS requirements.

Basic Properties
  • Mixture Viscosity @25°C : 700 ~ 1,300 cps
  • Density @20°C : 1.9 ~ 2.0 g/cm³
  • Curing Conditions : 80°C for 4 hours or 100°C for 3 hours
  • Hardness (DIN 53505) : Shore D70 ~ 75
  • Glass Transition Temperature (DSC) : 80 ~ 90°C
  • Thermal Conductivity (ISO 22007-2.2) : >6 W/mK
  • Coefficient of Thermal Expansion : 115 ppm/°C
  • Dielectric Strength : 12 kV/mm
  • Volume Resistivity @10 - 25°C : >1.0 x 10¹³ ohm-cm
  • Shelf Life @10 - 25°C : 6 months (unopened)
We have been successful in establishing our brand and sale to the international market due to our excellent quality and service of

Potting Compound

. Delivering the best quality products conforming to the cultural needs of the client is the ultimate goal of us.