Mobile Phone Back 2017-09-22 03:21:34
A mold four points Texture pack: PC Production methods: Foundry mold, Patent reserved. Applications face: 3C products industry - the back cover of the phone. Pric ...
Cell Phone Back 2017-09-22 03:21:25
A mold two points Material: PC Trait: High heat resistance. Dimensional stability, widely used in 3C product Output mode: Custom mold foundry XFire Applications f ...
Phone Cover 2017-09-22 03:21:54
Phone under cover A mold two points Materials: (PC+CF10%)+TPE Forms of production: Foundry mold Xfire. Use surface The semiconductor industry - phone back cover. ...
Phone Back 2017-09-22 03:21:03
A mold two points Contents: PC Characteristics contents: High impact resistance. Output form: Mold manufacturing, all rights reserved. Applications: Back cover fo ...